Power Module Packaging Market to Reach $25 Billion by 2032, Growing at a CAGR of 6.37% Market Overview:
The Power Module Packaging Market is projected to expand from USD 14.34 billion in 2023 to USD 25.0 billion by 2032, with an expected CAGR of 6.37% during the forecast period from 2024 to 2032.
The power module packaging market refers to the technology used to encapsulate and protect power semiconductor devices, which are essential for efficient power...